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| High Current, Low-Profile Power Inductors FLAT-PACTM FP0705 Series Applications * * * * * * * * Portable electronics Servers and workstations Data networking and storage systems Notebook and desktop computers Graphics cards and battery power systems Multi-phase regulators Voltage Regulator Module (VRM) DCR sensing SMD Device Description * * * * * * * 125C maximum total temperature operation 7.0 x 7.0 x 4.95mm surface mount package Ferrite core material, High current carrying capacity Low core losses Controlled DCR tolerance for sensing circuits Inductance range from 72nH to 220nH Current range from 20 to 65 Amps, frequency range up to 2MHz * RoHS compliant Environmental Data * Storage temperature range: -40C to +125C * Operating temperature range: -40C to +125C (Range is application specific) * Solder reflow temperature: J-STD-020D compliant Packaging * Supplied in tape-and-reel packaging, 950 parts per reel, 13" dia. reel Product Specifications Part Number R1 Version FP0705R1-R07-R FP0705R1-R10-R FP0705R1-R12-R FP0705R1-R15-R FP0705R1-R18-R FP0705R1-R22-R R2 Version FP0705R2-R07-R FP0705R2-R10-R FP0705R2-R12-R FP0705R2-R15-R FP0705R2-R18-R FP0705R2-R22-R R3 Version FP0705R3-R07-R FP0705R3-R10-R FP0705R3-R12-R FP0705R3-R15-R FP0705R3-R18-R FP0705R3-R22-R OCL1 10% (nH) FLL2 Min. (nH) 72 105 120 150 180 220 72 105 120 150 180 220 72 105 120 150 180 220 51 75 86 108 130 158 51 75 86 108 130 158 51 75 86 108 130 158 Irms3 (Amps) Isat14 @ 25C (Amps) Isat25 @ 125C (Amps) DCR (mOhm)@20C K-factor6 65 44 37 30 25 20 65 44 37 30 25 20 65 44 37 30 25 20 50 36 30 24 20 16 50 36 30 24 20 16 50 36 30 24 20 16 826 826 826 826 826 826 826 826 826 826 826 826 826 826 826 826 826 826 43 0.25 10% 38 0.32 9.4% 32 0.46 6.5% 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 3 Irms: DC current for an approximate temperature rise of 40C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125C under worst case operating conditions verified in the end application. 4 Isat1: Peak current for approximately 20% rolloff at +25C. 5 Isat2: Peak current for approximately 20% rolloff at +125C. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH), I (peak-to-peak ripple current in amps). 7 Part Number Definition: FP0705Rx-Rxx-R * FP0705 = Product code and size * Rx is the DCR indicator * Rxx= Inductance value in H, R = decimal point * "-R" suffix = RoHS compliant 05-05-08 BU-SB08210 Page 1 of 4 Data Sheet: 4325 Dimensions - mm Top View B 1 A = 7.0 Max. B = 7.0 Max. C = 4.95 Max. Bottom View D = 2.45 0.2 E = 1.52 0.2 F = 3.5 Typ. Schematic Side View C b Recommended Pad Layout 3.1 E 2.0 3.3 1 0705Rx Rxx wwllyy R 2 A F 2 a Nominal DCR is measured from point "a" to point "b." Part Marking: Coiltronics Logo 0705Rx (Rx = DCR indicator) D wwllyy = date code R = revision level Rxx = inductance value in H (R = decimal point) Packaging Information - mm 2.0 4.0 1.5 dia. A 1.75 1 7.5 0705Rx Rxx wwllyy R 2 16.00 0.30 6.5 7.1 3.5 7.1 5.1 SECTION A-A SECTION B-B 1.5 dia 12.0 A B B User direction of feed Supplied in tape-and-reel packaging, 950 parts per reel, 13" diameter reel. Temperature Rise vs. Total Loss 80 Temperature Rise (C) 60 40 20 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Total Loss (W) 05-05-08 BU-SB08210 Page 2 of 4 Data Sheet: 4325 Inductance Characteristics OCL vs. Isat1 100% 80% % of OCL 60% 40% 20% +125C +25C -40C 0% 0% 20% 40% 60% % of Isat1 80% 100% 120% Core Loss Core Loss vs. Bp-p 10 1MHz 500kHz 300kHz 1 200kHz 100kHz 0.1 Core Loss(W) 0.01 0.001 0.0001 0.00001 100 1000 10000 Bp-p (Gauss) 05-05-08 BU-SB08210 Page 3 of 4 Data Sheet: 4325 Solder Reflow Profile TP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s TL Preheat A t tP TC -5C Table 1 - Standard SnPb Solder (T c) Package Thickness <2.5mm _ >2.5mm Volume mm3 <350 235C 220C Volume mm3 _ >350 220C 220C Temperature T smax Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness <1.6mm 1.6 - 2.5mm >2.5mm Time Volume mm3 <350 260C 260C 250C Volume mm3 350 - 2000 260C 250C 245C Volume mm3 >2000 260C 245C 245C 25C Time 25C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak * Temperature min. (Tsmin) * Temperature max. (Tsmax) * Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to Peak Temperature Standard SnPb Solder 100C 150C 60-120 Seconds 3C/ Second Max. 183C 60-150 Seconds Table 1 20 Seconds** 6C/ Second Max. 6 Minutes Max. Lead (Pb) Free Solder 150C 200C 60-120 Seconds 3C/ Second Max. 217C 60-150 Seconds Table 2 30 Seconds** 6C/ Second Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire * LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. (c) 2008 Cooper Bussmann St. Louis, MO 63178 w w w. c o o p e r b u s s m a n n . c o m 05-05-08 BU-SB08210 Page 4 of 4 Data Sheet: 4325 |
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